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Title: Holoflex Ltd Honoured with FIPSA 2025 Award for Innovation in Smart & Secure Packaging

India, 9th Jul 2025 — Holoflex Ltd., a leading Indian manufacturer of security holograms and smart authentication solutions, has been honoured with the prestigious, FIPSA–2025 (Awards For Responsible Packaging), under the category New Concept / Futuristic (Innovation) for its pioneering innovation, “PHYGITAL Secure Level”.Organized by the FOUNDATION FOR INNOVATIVE PACKAGING AND SUSTAINABILITY (FIPS) in collaboration with the National Institute of Design (NID), Madhya Pradesh (Ministry of Commerce & Industry, Government of India), the FIPSA awards aim to recognize excellence in packaging design and innovation. The jury, comprising eminent experts, evaluated over 200 entries from across the country in Commercial, Start-up, and Student categories.Holoflex’s winning entry, PHYGITAL Secure Level, is a pioneering tamper-evident label solution designed to transform the landscape of secure and smart packaging. The innovation seamlessly merges physical security features with digital authentication, ensuring robust protection against counterfeiting while enhancing end-user trust.Key Highlights of the PHYGITAL Secure Level Technology:PHYGITAL Security Integration: Combines intricate physical security printing—such as guilloche patterns and microtext—with real-time digital verification.Multi-Layer Protection: Features a holographic stripe embedded with overt and covert security elements.Traceability with QR & Barcode: Empowers both brands and consumers with easy product verification and supply chain visibility.Holographic Scratch-Off Layer: Adds another layer of security through a unique identification code hidden under a scratch-off panel.The label is especially relevant for industries prone to counterfeit risks, including nutraceuticals,...

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